Solder Rings & Sheets
Custom annular and flat preforms, including lead-free, low-temperature and high-temperature options.
Dongguan precision solder-material manufacturing
Solder Preforms Shaped Around Your Process
Gujing manufactures custom solder rings, sheets, ribbons and balls, together with solder paste and electronic adhesives, for precision joining in electronics, semiconductor, communication and new-energy applications.
Factory profile
Custom micro-soldering materials—not just commodity tin
Gujing turns an alloy and joint design into repeatable preforms with controlled geometry and packaging. Qualification starts with the heating method, joint materials, target volume and reliability requirements.
Established 2015Public registration/exhibitor profile
Dongguan, ChinaOn-site reviewed location
Custom preformsManufacturer product scope
Anhui affiliateNew-material expansion stated
Product families01 · PREFORMS 02 · SHAPED SOLDER 03 · DISPENSABLE 04 · FUNCTIONAL
Select by joint geometry and process
Ribbon, Strip & Balls
Controlled geometry for automated placement, localized joining and microelectronic processes.
Solder Paste
Fine-alloy and LED die-attach pastes; alloy and powder grade require confirmation.
Electronic Adhesives
Adhesive and thermal-interface materials, subject to technical datasheet review.
Technical RFQ
The six inputs needed for a useful quotation
| Input | What to provide | Why it matters |
|---|---|---|
| Alloy | Composition, lead-free requirement, melting range | Wettability and process temperature |
| Geometry | OD/ID/thickness or 2D drawing | Solder volume and joint fit |
| Tolerance | Critical dimensions and inspection method | Placement repeatability |
| Flux | Flux-free or type/content/residue | Oxide removal and cleaning |
| Process | Laser, pulse, hot-bar, reflow or other | Thermal profile selection |
| Packaging | Tray, reel, tube, bag and cleanliness | Automation and oxidation control |
Application fit
Precision joints across fast-growing electronics
Public materials place Gujing products in semiconductor, Mini LED, 5G communication, consumer electronics, automotive electronics, smart wearables and new-energy applications.
- Laser and pulse soldering
- Hot-bar and localized joining
- Feedthrough and connector sealing
- Die attach and microelectronic assembly
- High-volume automated placement
Evidence to confirm with each lot
Alloy composition report, dimensional inspection, flux content, melting behavior, storage life, packaging label, lot traceability and applicable RoHS/REACH declarations.
Named customers found in exhibitor materials are not displayed as endorsements without written permission or transaction-level evidence.
Buyer FAQ
Before requesting samples
Can solder rings and sheets be customized?
Yes. Provide alloy, drawing, tolerances, flux, heating process, monthly demand and packaging format.
Has the factory been visited?
Yes. Its presence and manufacturing operation in the Dongguan industrial park have been reviewed on site. This does not replace model, certificate or lot-level quality documentation.
Which alloys and dimensions are available?
The public website shows lead-free, low-temperature and high-temperature products but not a complete verified matrix. Confirm the exact alloy and dimensional range with a drawing.
Are samples available?
The manufacturer publicly offers sample trials. Quantity, tooling, freight, timing and qualification conditions require confirmation.
Sample / quotation brief
Prepare the data before calling
The currently confirmed public contact is the manufacturer’s mobile number. Copy the brief, add your values and send it through the contact method agreed with the company.
Telephone: +86 188 2031 9799
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